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HYPERPCB

— CAPABILITIES

Aluminum & Metal Core PCB Capability

HyperPCB manufactures aluminium and copper core PCBs with thermal conductivity from 1.0 to 6.0 W/mK for LED lighting, power conversion and motor drives, in single-sided, double-sided and hybrid constructions.

Aluminum & Metal Core PCB Capability — representative build

— SPECIFICATIONS

Capability & tolerance chart

Aluminum & Metal Core PCB Capability — standard vs advanced.
ParameterStandardAdvanced
Supported StructuresSingle-sided metal core, double-sided metal core with plated through holes, multilayer and hybrid metal-backed builds—
Core and Base MaterialsAluminium core, copper core and direct thermal path copper structures—
Finished Board Thickness39.4 – 197 mil—
Thermally Conductive Dielectric0.5 – 8.0 W/m·K, subject to material selection—
Registration Accuracy1.97 mil single-sided2.95 mil double-sided / PTH
Routing / Forming Accuracy±3.94 mil—
Profile / Positional Tolerance±7.87 mil±5.91 mil on advanced builds
Back-Drill Depth Tolerance±7.87 mil where applicable±3.94 mil where applicable
Surface FinishesLead-free HASL, ENIG, electrolytic gold, immersion tin, OSP—
Production SupportPrototype, low-volume and volume production—

Thermal resistance, not just conductivity

The number that matters to your junction temperature is the thermal resistance from component pad to heatsink, and the dielectric layer dominates it. A 6 W/mK dielectric at 100 µm behaves very differently from 1 W/mK at the same thickness, so we quote the combination rather than a single headline figure.

Machining and isolation

Metal core boards are routed, counterbored and tapped as metal parts, and the exposed core must stay electrically isolated from the circuit. Mounting holes, clearances and edge isolation are reviewed with your mechanical drawing before tooling.

— FAQ

Frequently asked questions

Start from the power dissipated and the temperature rise you can accept; we will propose a dielectric and thickness combination between 1.0 and 6.0 W/mK that meets it.

Yes. Hybrid constructions bond a conventional multilayer circuit to an aluminium or copper core when both routing density and heat spreading are needed.

Aluminium covers most lighting and power applications at lower cost and weight; copper is used where thermal performance outweighs both.

— RELATED

Related capabilities

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