— PCB ASSEMBLY
SMT Assembly
HyperPCB provides SMT assembly down to 0201 passives and 0.4 mm pitch BGAs, with solder paste inspection, 100% AOI and 3D X-ray on hidden joints, from one prototype to 1,000-piece production runs.
— SPECIFICATIONS
Capability & tolerance chart
| Parameter | Standard | Advanced |
|---|---|---|
| Supported PCB Types | Single-sided, double-sided, multilayer, flexible and rigid-flex assemblies | — |
| Substrate Handling | Up to 510 × 460 mm, board thickness 7.87 – 315 mil | — |
| Placement Size Range | From 50 × 50 mm | Large-format assemblies up to 900 × 600 mm on review |
| Placement Thickness Range | 19.7 – 236 mil, subject to equipment route | — |
| Placement Accuracy | ±0.98 mil, equipment-process CPK ≥ 1.3 | — |
| Assembly Complexity | Double-sided SMT, high-density placement and HDI-related assembly | — |
| Odd-Form Components | Supported after process-feasibility review | — |
| Reflow Soldering | Controlled temperature profiling with nitrogen protection | — |
| Vacuum Soldering | Available where void control matters, subject to process review | — |
| Production Models | Prototype, NPI, low-volume, high-mix and repeat production | — |
| Annual SMT Placements | 1.2 billion | — |
| Assembly Facility | 11,000 m² with 600+ production, engineering and quality staff | — |
Reflow profiles are per assembly, not per line
A 6-layer board with a heavy copper plane and a thin RF board do not reflow the same way. Each assembly gets a profile developed against its own thermal mass, and the profile is recorded with the lot so a repeat build is genuinely a repeat.
Data that speeds up the first build
Centroid data with rotations, a BOM with manufacturer part numbers, polarity markings on the assembly drawing and any do-not-populate list. With those four items a first article usually needs no clarification round.
— FAQ
Frequently asked questions
— RELATED
Related assembly services
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