Skip to content
HYPERPCB
Get a quote

— CAPABILITIES

High-Speed PCB Capability

HyperPCB manufactures high-speed digital PCBs with ±7% controlled impedance, low-loss and hybrid stack-ups, back-drilled stubs and TDR verification on every controlled-impedance lot — up to 48 layers with 50 µm laser vias.

High-Speed PCB Capability — representative build

— SPECIFICATIONS

Capability & tolerance chart

High-Speed PCB Capability — standard vs advanced.
ParameterStandardAdvanced
PCB TypesHigh-speed, controlled-impedance, high-layer-count, server, networking and optical module boards—
Layer Count4 – 48 layers—
Maximum Board Size1000 × 600 mm for high-layer-count builds—
Finished Board Thickness11.8 – 276 mil for high-layer-count boardsThicker structures by project review
Minimum Line Width / Spacing1.97/1.97 mil1.38/1.38 mil for advanced high-density products
Line Width Tolerance±0.59 mil for precision signal structures—
Minimum Mechanical Drill3.94 – 5.91 mil, depending on structure—
Through-Hole Aspect RatioUp to 20:1—
Controlled Impedance±10%±7% by stack-up, material and design review
High-Speed Signal SupportUp to 128 Gbps class by stack-up and material review—
Back DrillingSupported for stub reduction in high-speed channels—
Via StructuresThrough, blind, buried, via-in-pad, resin-plugged, filled and capped vias—
Advanced ProcessesBack drilling, sequential lamination, controlled-depth routing, step grooves, edge plating, embedded copper—
MaterialsLow-loss, high-speed, High Tg FR-4, halogen-free FR-4 and mixed dielectric systems—

Impedance is a manufacturing outcome

A trace width that models correctly still fails if etch, dielectric thickness and copper roughness are unknown. We work backwards from your target: choose the dielectric we fabricate, compensate the artwork for etch, then measure the result by TDR on coupons from the same panel as your boards.

Via stubs and back drilling

At multi-gigabit rates an unused via stub is a resonator. Where the layer transition allows, back drilling removes the stub to 0.20 mm as standard and 0.15 mm on request, with depth verified on cross-sections.

— FAQ

Frequently asked questions

Yes. Trace widths are adjusted per copper weight and dielectric so the finished impedance, not the drawn width, hits the target.

0.20 mm as standard and 0.15 mm on advanced builds, confirmed by cross-section.

Yes. Low-loss layers are bonded to FR-4 cores where only part of the design carries high-speed signals, which keeps cost proportionate to the requirement.

— RELATED

Related capabilities

HDI PCB Capability

HyperPCB builds high-density interconnect PCBs from 1+N+1 to 4+N+4 and ELIC, with laser microvias down to 50 µm, 0.10 mm mechanical drills and 1:1 blind via aspect ratio — up to 48 layers with ±7% controlled impedance.

Learn more

High-Frequency PCB Capability

HyperPCB fabricates high-frequency PCBs on laminates it manufactures itself, covering Dk 2.17 to 10.2 with PTFE, hydrocarbon-ceramic and composite substrates, signal integrity verified to 40 GHz and impedance held to ±7%.

Learn more

Multilayer PCB Capability

HyperPCB manufactures multilayer PCBs up to 48 layers and 1000 × 600 mm, with finished thickness from 0.1 to 12.0 mm, 20:1 through-hole aspect ratio and ±7% controlled impedance, released with 100% AOI on every layer.

Learn more
Ready to build?

Ready to build?

Upload your Gerber files for a free DFM review and a quote within 24 hours. Mutual NDA available.

Upload Gerber · 24h QuoteTalk to an engineer