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— CAPABILITIES

High-Frequency PCB Capability

HyperPCB fabricates high-frequency PCBs on laminates it manufactures itself, covering Dk 2.17 to 10.2 with PTFE, hydrocarbon-ceramic and composite substrates, signal integrity verified to 40 GHz and impedance held to ±7%.

High-Frequency PCB Capability — representative build

— SPECIFICATIONS

Capability & tolerance chart

High-Frequency PCB Capability — standard vs advanced.
ParameterStandardAdvanced
PCB TypesHigh-frequency, RF, microwave, antenna, mixed dielectric and high-speed high-frequency boards—
Material TypesPTFE, ceramic-filled PTFE, hydrocarbon ceramic-filled, PPO/PPE, modified epoxy, low-loss and high-speed systems—
Layer Count2-layer to multilayerHigh-layer mixed dielectric structures by project review
Board Thickness5 – 197 mil, depending on material and stack-up—
Maximum Board Size570 × 500 mm for high-frequency precision workLarger sizes depending on material and structure
Minimum Line Width / Spacing2.5/2.5 mil standard process1.38/1.38 mil for advanced products, design-dependent
Line Width Tolerance±0.59 mil for precision microwave lines—
Minimum Mechanical Drill3.94 mil for advanced structures—
Controlled Impedance±8% typicalTighter tolerance by project review
High-Speed Signal SupportUp to 128 Gbps class by stack-up and material review—
Special ProcessesBack drilling, controlled-depth routing, step grooves, blind and buried vias, resin-plugged vias, metal edge plating, mixed dielectric lamination—
Surface FinishesENIG, ENEPIG, OSP, immersion silver, immersion tin, hard gold, soft gold—

The laminate is the product

Above a few gigahertz the board stops being a wiring medium and becomes part of the circuit. Because we fabricate the laminate, dielectric constant, loss tangent, resin content and copper profile are known and repeatable across batches — no substitution notice halfway through your production run.

Hybrid stack-ups

Most RF products only need low-loss material on two or three layers. Bonding PTFE or hydrocarbon-ceramic layers to FR-4 cores keeps the RF performance where it matters and the cost where it belongs. We model the hybrid stack-up and confirm the bond system before quoting.

What we need to model your line

Target impedance and tolerance, operating frequency, the reference layer for each controlled line, and whether loss or phase stability drives the design. We return the stack-up with modelled trace widths and the measured Dk we will build to.

— FAQ

Frequently asked questions

Dk 2.17 to 10.2 across our PTFE, hydrocarbon-ceramic and composite families, all fabricated in-house with factory-direct datasheets.

Signal integrity is verified to 40 GHz on production builds.

In most cases yes — send the datasheet parameters that matter to your design and we will propose the closest in-house equivalent with measured data, not a marketing cross-reference.

— RELATED

Related capabilities

HDI PCB Capability

HyperPCB builds high-density interconnect PCBs from 1+N+1 to 4+N+4 and ELIC, with laser microvias down to 50 µm, 0.10 mm mechanical drills and 1:1 blind via aspect ratio — up to 48 layers with ±7% controlled impedance.

Learn more

High-Speed PCB Capability

HyperPCB manufactures high-speed digital PCBs with ±7% controlled impedance, low-loss and hybrid stack-ups, back-drilled stubs and TDR verification on every controlled-impedance lot — up to 48 layers with 50 µm laser vias.

Learn more

PCB Manufacturing Capability

HyperPCB fabricates single-sided through 48-layer boards up to 1000 × 600 mm: 2.5/2.5 mil trace and space standard, 35/35 µm advanced, 0.10 mm drills, 50 µm laser vias, ±7% impedance. Every lot is released with AOI and TDR records.

Learn more
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