How to remove component information from ODB++ without breaking fabrication

You can remove component information from ODB++ by exporting a “fabrication‑only” ODB++ from CAD, or by stripping component and BOM data from an existing ODB++ job and then validating the result.

What in ODB++ counts as component information?

ODB++ can carry placement (reference designators, XY/rotation, side), BOM attributes (value, MPN), pin‑to‑net mappings, and assembly drawings. Silkscreen text is just graphics; it only exposes components if your refdes text remains on silkscreen or assembly layers.

Method 1: export ODB++ without assembly data

Most CAD tools offer an export option to exclude components/assemblies. In the ODB++ export dialog, deselect component placement and BOM/part attributes, keep image layers and drills, and (if your fabricator performs netlist compare) keep the electrical netlist. Regenerate the ODB++ and verify in a viewer.

Method 2: strip an existing ODB++ job safely

1) Duplicate the job for editing. 2) Unpack the ODB++ container (it is a directory tree, often distributed as a .tgz). 3) Remove any folders or tables clearly dedicated to components and assemblies (commonly named with “component”, “comp”, “placement”, or “assembly”). 4) Search all remaining ASCII tables for attributes such as refdes, value, mpn, supplier, part_number and delete those attributes or the rows that solely hold BOM data. 5) If you want to retain nets but anonymize pins, remove attributes that bind pad features to component pin numbers; keep the net attributes so electrical test remains possible. 6) Repack the directory tree and validate.

Method 3: regenerate a bare ODB++ from Gerber and drill

For a tool‑agnostic approach, import your copper, mask, paste, silkscreen Gerbers and Excellon drills (plus IPC‑356 if you want net connectivity) into a CAM tool, then export ODB++. ODB++ created from Gerber data will contain image layers and drills only—no components/BOM by construction.

What should I keep for fabrication?

For bare‑board builds, provide at minimum: copper layers, solder mask, silkscreen, paste (if you need step‑and‑repeat or stencil data), drills (plated and non‑plated), board outline/rout, and an IPC‑356 netlist if you want the fabricator to run netlist compare during CAM or E‑test. Keeping nets while removing components preserves testability without exposing your BOM.

How do I verify components are truly gone?

Open the job in a free ODB++ viewer (e.g., Siemens ODB++ Viewer). Confirm that the Components/Placements tree is empty, attributes browser does not list refdes/value/MPN on features, and netlist still exists if you chose to keep it. Zoom silkscreen/assembly layers to ensure printed refdes are not present if you intended to suppress them.

Common pitfalls and edge cases

• Silkscreen refdes are graphics; if you don’t want them visible, delete them from silkscreen/assembly layers before export.

• Removing pin identifiers while keeping nets can protect schematic intent but may limit certain downstream test processes; for bare boards, nets plus IPC‑356 is usually sufficient.

• If you fully remove nets, provide clear drill/rout and consider adding IPC‑356 later if the fabricator requests electrical testing.

• Always validate after stripping—don’t assume a deleted folder removed all attributes.

Send‑to‑fab checklist (bare board, no components)

• Copper, solder mask, silkscreen, paste (as needed)

• Excellon drills (plated/non‑plated), rout/outline

• IPC‑356 netlist retained (recommended)

• No component/placement/BOM tables or attributes

• Viewer check: no Components tree, no refdes/value/MPN attributes

Quality and build options at HyperPCB

We can build and inspect to IPC Class 2 or IPC Class 3 acceptance criteria, and support RoHS and REACH compliance. Our quality management system is ISO 9001:2015 certified (certificate no. CN-2023-Q1156, SGS, valid until June 2027). For new packages, we return quotes within 24 hours and DFM feedback within 1 business day.