What software do you need for PCB and prototype assembly?

Use ECAD, CAM/DFM, pick-and-place, inspection, MES/PLM, and test software to take a PCB design into prototype assembly with fewer surprises.

Toolchain overview for PCB and prototype assembly

• ECAD and libraries: schematic/PCB layout, BOM and footprints (e.g., Altium Designer, KiCad, Cadence OrCAD/Allegro). Output Gerber X2, ODB++, or IPC‑2581 plus BOM and centroid (XYRS) data.

• CAM/DFM: manufacturing rule checks, paste data, panelization and drill/tooling (e.g., Siemens Valor NPI, DownStream CAM350, UcamX). Targets IPC‑7351 land patterns and stencil optimizations.

• Stencil/CAD: aperture reductions and windowpane patterns for QFN/BGA, step‑downs where needed.

• Pick‑and‑place programming: import XYRS/CPL into machine software (Fuji Nexim, Panasonic PanaCIM, ASM SIPLACE Pro, Yamaha iPulse) with feeder mapping and vision centroids.

• Solder paste inspection (SPI) and AOI: Koh Young/CyberOptics SPI and Mirtec/Omron AOI with SPC dashboards and CAD overlays.

• MES/PLM and traceability: lot codes, date codes, MSD handling, labeling, and traveler control; ERP/PLM sync of MPN/AVL and alternates.

• Test and programming: boundary scan (Corelis/XJTAG), flying probe (Takaya), ICT (Keysight i3070), and functional test (LabVIEW/Python + PXI/USB instruments).

Which design files and formats should you send?

Provide Gerber RS‑274X or Gerber X2, or a single ODB++/IPC‑2581 archive; include fabrication and assembly drawings as PDF. Add centroid (XYRS/CPL) for all placements with units (mm or mil), side (Top/Bottom), rotation, and reference designator. Share a machine‑readable BOM (CSV/XLSX) with manufacturer part numbers (MPN), approved vendor list (AVL), DNP flags, and alternates. Include paste layers (GTP/GBP) for stencil, fiducials, and any step‑thickness notes. If panelized, include panel drawing, fiducials, tooling holes, and break‑off style (v‑score or tabs with mouse bites). For coordinates, 3–4 decimals in mm (0.001–0.0001 mm) or 2–3 decimals in inch (0.01–0.001 in) keep placement repeatable.

How to generate accurate pick-and-place data?

Export XYRS from your ECAD with package, rotation, and side fields. State your rotation convention in a README and confirm bottom‑side rotation rule (some machines expect 180° − θ or sign‑inverted angles). Align the XY origin to board datum or panel fiducials and document it. Run a viewer overlay: load Gerber plus XYRS into your CAM or viewer and verify that a few fine‑pitch ICs and polarized parts (DPAK, SOD‑123, tantalum) land correctly. For double‑sided builds, flag heavy or tall parts that require glue dots or sequence changes during reflow.

DFM and CAM checks that actually catch issues

Set solder mask expansion around SMD pads to 2–4 mil (0.05–0.10 mm) and silkscreen‑to‑copper clearance ≥4 mil to avoid smear. Maintain annular ring ≥4 mil on vias you must probe; tent or fill/cap via‑in‑pad under BGA or QFN, especially for ≤0.5 mm pitch. Place at least two global fiducials on opposite board corners and one local fiducial near dense BGAs; 1.0 mm bare copper with 2.0 mm solder mask clearance works well. Typical prototype stencil thickness is 100–130 µm (4–5 mil); target stencil area ratio ≥0.66 and use windowpane or reduced apertures on large thermal pads to limit voiding. If you must hand‑place or rework, add keepout space around tall connectors and heatsinks for nozzle access.

Programming, inspection, and test software in prototypes

Provide BSDL files and a netlist for boundary scan; mark test points in ECAD and output an IPC‑D‑356A netlist if available. For flying probe, add exposed test pads ≥0.9 mm with mask clearance and document nets. Tie firmware images and calibration data to BOM revisions in your PLM; an MES traveler with SN, MAC, or keys prevents mix‑ups during first articles. AOI libraries benefit from component height, polarity, and marking examples; include a photo or 3D render of the intended orientation for diodes, electrolytics, and connectors.

Submission and quality at HyperPCB

HyperPCB operates an ISO 9001:2015 certified quality management system (certificate CN-2023‑Q1156, issued by SGS, valid until June 2027). We return quotes within 24 hours and DFM feedback within 1 business day. Boards can be built and inspected to IPC Class 2 or IPC Class 3 acceptance criteria, and RoHS/REACH compliance is supported. Our partner factory AEGIS maintains ISO 9001:2015, ISO 14001:2015, and ISO 45001:2018 management systems, and also holds ISO 13485:2016 and IATF 16949 for regulated sectors.